| # | Position | Work Location | Date Posted | |
| 1. | Product Engineer (Characterization) | Singapore | 01 Feb 2010 | |
| 2. | Equipment Technicians (Cleanroom/Encapsulation & Post-Encapsulation) | Singapore | 22 Jan 2010 | |
| 3. | Process Engineers (Backgrind/Dicing, DieLam or Wirebond) | Singapore | 22 Jan 2010 | |
| 4. | Facilities Technicians | Singapore | 22 Jan 2010 | |
| 5. | Process Engineers (Backgrind/Dicing, DieLam or Wirebond) | Singapore | 22 Jan 2010 | |
| 6. | Equipment Technicians (Cleanroom/Encapsulation & Post-Encapsulation) | Singapore | 22 Jan 2010 | |
| 7. | Facilities Technicians | Singapore | 22 Jan 2010 | |
| 8. | Module Equipment Technicians | Singapore | 22 Jan 2010 | |
| 9. | Process Engineering Assistants (Module) | Singapore | 22 Jan 2010 | |
| 10. | Product Engineer – (DRAM/NAND Probe/Burn Support) | Singapore | 22 Jan 2010 | |
| 11. | DRAM/NAND Test Engineers | Singapore | 21 Jan 2010 | |
| 12. | Product Engineers (Device) | Singapore | 21 Jan 2010 | |
| 13. | Senior/Assembly Product Engineers | Singapore | 21 Jan 2010 | |
| 14. | Equipment Technician (Encapsulation and Post-Encapsulation) | Singapore | 15 Jan 2010 | |
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